Introducing EMF Technology for Extrusion

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The EMF sensing technology was recently developed to measure true thickness, temperature and field measurement in extrusion accurately without isotopic radiation. With issues of varying densities and weight due to large amounts of recycled material, CaCO2 and even resin, a new approach was needed to measure true thickness and temperature at the point of measurement. Unlike beta/Xray devices used today, it is a Direct measurement vs. correlated measurement based on density/weight. Also, unlike lasers or vision, it measures the EM field within the material versus an optical measurement on the surface. Temperature at the point of measurement also provides for proven process improvement, trouble shooting and predictability monitoring.

Along with measurement, Mikros has full die mapping/control capabilities and detailed reporting options. Sensors still traverses across the sheet, similar to beta/Xray scanners, but sensors are entirely different with the size/weight and install time of these scanners being much less.

The EMF scanning frames also offer some much-needed new technology. Mikros partner MCS in Holland developed a belt-less frame using new high precision servo drives which are also lighter, more accurate and eliminate slipping found with the larger drive/belt systems today. The servo drives have over 10 years MTBF with repeatability performance within +/-0.02%. They also provide independent bottom/top drives for easy

servicing and alignment. The EMF and frame technology easily measure thickness ranges from 6µm to 0.7”. Multiple systems are installed within the US and Europe in extrusion, flooring and other operations with exceeding overall performance . No more isotopic radiation necessary!